| USA- CompTIA Exam Objectives | |
 |
| | Exam : A+ Core Hardware | |
|
| | Domain : 1.0 Installation, Configuration and Upgrading (35%) | |
|
| | Objective : 1.1 Identify the names, purpose, and characteristics, of system modules. Recognize these modules by sight or definition. | |
|
| | Content : Examples of concepts and modules are:
o Motherboard
o Firmware
o Power supply
o Processor /CPU
o Memory
o Storage devices
o Display devices
o Adapter cards
o Ports
o Cases
o Riser cards
| |
|
| | Objective : 1.2 Identify basic procedures for adding and removing field-replaceable modules for desktop systems. Given a replacement scenario, choose the appropriate sequences. | |
|
| | Content : Desktop components:
o Motherboard
o Storage device
o FDD
o HDD
o CD/CDRW
o DVD/DVDRW
o Tape drive
o Removable storage
o Power supply
o AC adapter
o AT/ATX
o Cooling systems
o Fans
o Heat sinks
o Liquid cooling
o Processor /CPU
o Memory
o Display device
o Input devices
o Keyboard
o Mouse/pointer devices
o Touch screen
o Adapters
o Network Interface Card (NIC)
o Sound card
o Video card
o Modem
o SCSI
o IEEE 1394/Firewire
o USB
o Wireless
| |
|
| | Objective : 1.6 Identify proper procedures for installing and configuring common IDE devices. Choose the appropriate installation or configuration sequences in given scenarios. Recognize the associated cables. | |
|
| | Content : Content may include the following:
o IDE Interface Types
- EIDE
- ATA/ATAPI
- Serial ATA
- PIO
o RAID (0, 1 and 5)
o Master/Slave/cable select
o Devices per channel
o Primary/Secondary
o Cable orientation/requirements
| |
|
| | Objective : 1.9 Identify procedures to optimize PC operations in specific situations. Predict the effects of specific procedures under given scenarios. | |
|
| | Content : Topics may include:
o Cooling systems
o Liquid
o Air
o Heat sink
o Thermal compound
o Disk subsystem enhancements
o Hard drives
o Controller cards (e.g., RAID, ATA-100, etc.)
o Cables
o NICs
o Specialized video cards
o Memory
o Additional processors
| |
|
| | Domain : 2.0 Diagnosing and Troubleshooting (21%) | |
|
| | Objective : 2.1 Recognize common problems associated with each module and their symptoms, and identify steps to isolate and troubleshoot the problems. Given a problem situation, interpret the symptoms and infer the most likely cause. | |
|
| | Content : Content may include the following:
o I/O ports and cables
o Serial
o Parallel
o USB ports
o IEEE 1394/Firewire
o Infrared
o SCSI
o Motherboards
o CMOS/ BIOS settings
o POST audible/visual error codes
o Peripherals
o Computer case
o Power supply
o Slot covers
o Front cover alignment
o Storage devices and cables
o FDD
o HDD
o CD/CDRW
o DVD/DVDRW
o Tape drive
o Removable storage
o Cooling systems
o Fans
o Heat sinks
o Liquid cooling
o Temperature sensors
o Processor /CPU
o Memory
o Display device
o Input devices
o Keyboard
o Mouse/pointer devices
o Touch screen
o Adapters
o Network Interface Card (NIC)
o Sound card
o Video card
o Modem
o SCSI
o IEEE 1394/Firewire
o USB
o Portable Systems
o PCMCIA
o Batteries
o Docking Stations/Port Replicators
o Portable unique storage
| |
|
| | Domain : 3.0 Preventive Maintenance (5%) | |
|
| | Objective : 3.1 Identify the various types of preventive maintenance measures, products and procedures and when and how to use them. | |
|
| | Content : Content may include the following:
o Liquid cleaning compounds
o Types of materials to clean contacts and connections
o Non-static vacuums (chassis, power supplies, fans)
o Cleaning monitors
o Cleaning removable media devices
o Ventilation, dust and moisture control on the PC hardware interior.
o Hard disk maintenance (defragging, scan disk, CHKDSK)
o Verifying UPS (Uninterruptible Power Supply) and suppressors
| |
|
| | Objective : 3.2 Identify various safety measures and procedures, and when/how to use them. | |
|
| | Content : Content may include the following:
o ESD (Electrostatic Discharge) precautions and procedures
o What ESD can do, how it may be apparent, or hidden
o Common ESD protection devices
o Situations that could present a danger or hazard
o Potential hazards and proper safety procedures relating to o High-voltage equipment
o Power supply
o CRTs
| |
|
| | Objective : 3.3 Identify environmental protection measures and procedures, and when/how to use them. | |
|
| | Content : Content may include the following:
o Special disposal procedures that comply with environmental guidelines.
o Batteries
o CRTs
o Chemical solvents and cans
o MSDS (Material Safety Data Sheet)
| |
|
| | Domain : 4.0 Motherboard/Processors/Memory (11%) | |
|
| | Objective : 4.1 Distinguish between the popular CPU chips in terms of their basic characteristics. | |
|
| | Content : Content may include the following:
o Popular CPU chips (Pentium class compatible)
o Voltage
o Speeds (actual vs. advertised)
o Cache level I, II, III
o Sockets/slots
o VRM(s)
| |
|
| | Objective : 4.2 Identify the types of RAM (Random Access Memory), form factors, and operational characteristics. Determine banking and speed requirements under given scenarios. | |
|
| | Content : Content may include the following:
o Types
o EDO RAM (Extended Data Output RAM)
o DRAM (Dynamic Random Access Memory)
o SRAM (Static RAM)
o VRAM (Video RAM)
o SDRAM (Synchronous Dynamic RAM)
o DDR (Double Data Rate)
o RAMBUS
o Form factors (including pin count)
o SIMM (Single In-line Memory Module)
o DIMM (Dual In-line Memory Module)
o SoDIMM (Small outline DIMM)
o MicroDIMM
o RIMM
o Operational characteristics
o Memory chips (8-bit, 16-bit, and 32-bit)
o Parity chips versus non-parity chips
o ECC vs. non-ECC
o Single-sided vs. double sided
| |
|
| | Objective : 4.3 Identify the most popular types of motherboards, their components, and their architecture (bus structures). | |
|
| | Content : Content may include the following:
o Types of motherboards: - AT - ATX o Components: - Communication ports - Serial - USB - Parallel - IEEE 1394/Firewire - Infrared o Memory - SIMM - DIMM - RIMM - SoDIMM - MicroDIMM o Processor sockets - Slot 1 - Slot 2 - Slot A - Socket A - Socket 7 - Socket 8 - Socket 423 - Socket 478 - Socket 370 o External cache memory (Level 2) o Bus Architecture o ISA o PCI - PCI 32-bit - PCI 64-bit o AGP - 2X - 4X - 8X (Pro) o USB (Universal Serial Bus) o AMR (audio modem riser) slots o CNR (communication network riser) slots o Basic compatibility guidelines o IDE (ATA, ATAPI, ULTRA-DMA, EIDE) o SCSI (Narrow, Wide, Fast, Ultra, HVD, LVD(Low Voltage Differential)) o Chipsets
| |
|
| | Objective : 4.4 Identify the purpose of CMOS (Complementary Metal-Oxide Semiconductor) memory, what it contains, and how and when to change its parameters. Given a scenario involving CMOS, choose the appropriate course of action. | |
|
| | Content : CMOS Settings:
o Default settings
o CPU settings
o Printer parallel port—Uni., bi-directional, disable/enable, ECP, EPP
o COM/serial port—memory address, interrupt request, disable
o Floppy drive—enable/disable drive or boot, speed, density
o Hard drive—size and drive type
o Memory—speed, parity, non-parity
o Boot sequence
o Date/Time
o Passwords
o Plug & Play BIOS
o Disabling on-board devices
o Disabling virus protection
o Power management
o Infrared
| |
|
| | Domain : 5.0 Printers (9%) | |
|
| | Objective : 5.2 Recognize common printer problems and techniques used to resolve them. | |
|
| | Content : Content may include the following:
o Printer drivers
o Firmware updates
o Paper feed and output
o Calibrations
o Printing test pages
o Errors (printed or displayed)
o Memory
o Configuration
o Network connections
o Connections
o Paper jam
o Print quality
o Safety precautions
o Preventive maintenance
o Consumables
o Environment
| |
|
| | Objective : 5.1 Identify printer technologies, interfaces, and options/upgrades. | |
|
| | Content : Technologies include:
o Laser o Ink Dispersion o Dot Matrix o Solid ink o Thermal o Dye sublimation
| |
|
| | Content : Interfaces include:
o Parallel o Network o SCSI o USB o Infrared o Serial o IEEE 1394/Firewire o Wireless
| |
|
| | Content : Options/Upgrades include:
o Memory o Hard drives o NICs o Trays and feeders o Finishers (e.g., stapling, etc.) o Scanners/fax/copier
| |
|
| | Domain : 6.0 Basic Networking (19%) | |
|
| | Objective : 6.3 Identify common technologies available for establishing Internet connectivity and their characteristics. | |
|
| | Content : Technologies include:
o LAN
o DSL
o Cable
o ISDN
o Dial-up
o Satellite
o Wireless
| |
|
| | Content : Characteristic include:
o Definition
o Speed
o Connections
| |
|
| | Objective : 6.1 Identify the common types of network cables, their characteristics and connectors. | |
|
| | Content : Cable types include:
o Coaxial
- RG6
- RG8
- RG58
- RG59
o Plenum/PVC
o UTP
- CAT3
- CAT5/e
- CAT6
o STP
o Fiber
- Single-mode
- Multi-mode
| |
|
| | Content : Connector types include:
o BNC o RJ-45 o AUI o ST/SC o IDC/UDC
| |
|
| | Objective : 6.2 Identify basic networking concepts including how a network works. | |
|
| | Content : Concepts include:
o Installing and configuring network cards
o Addressing
o Bandwidth
o Status indicators
o Protocols
- TCP/IP
- IPX/SPX (NWLINK)
- AppleTalk
- NETBEUI/NETBIOS
o Full-duplex, half-duplex
o Cabling—Twisted Pair, Coaxial, Fiber Optic, RS-232
o Networking models
- Peer-to-peer
- Client/server
o Infrared
o Wireless
|
